The new SPHBM4 standard combines HBM4 DRAM ICs with standard packaging and a narrower 512-bit interface, allowing integration on less expensive organic substrates without advanced packaging like TSMC's CoWoS. This approach supports higher data transfer rates (22.4 GT/s to 46.0 GT/s) to offset the narrower interface, potentially reducing overall HBM costs. The specification could particularly benefit Chinese AI accelerator developers currently restricted from using advanced manufacturing and packaging services.