Korean and Japanese Researchers Propose Novel HBM Architectures to Overcome Thermal and Bandwidth Limits

Researchers from UNIST presented V-Die, a design that rotates DRAM dies upright, integrates liquid cooling, and achieved 540 tokens per second on a GPT-3 workload in simulations, significantly outperforming HBM4's 296 tokens per second. Separately, University of Tokyo researchers introduced MOSAIC, which uses orthogonal die stacking and a contactless inductive coupling interface, demonstrating up to 4 Gbps per channel and potential to double HBM4 capacity without increasing peak temperature.