JEDEC announced the release of JESD330-4, or SPHBM4, on July 13, which reuses HBM4 DRAM dies but allows installation on standard organic substrates via a new interface base die. This standard defines 512 data signals, achieving the same total throughput as traditional HBM4 through 4:1 serialization, thereby relaxing bump pitch requirements and reducing reliance on silicon interposers. The shift to organic substrates could increase configurable SPHBM stacks between SoC and memory, potentially expanding HBM-class memory to more AI accelerators and custom ASICs.