Huawei is reportedly constructing a 12-inch wafer fab line in Shenzhen, China, with a planned production capacity of 140,000 wafers per month for 28nm DRAM, through a joint venture with SwaySure. This move aims to insulate Huawei from US technology restrictions and external semiconductor supply constraints, driven by surging AI-related demand for DRAM and HBM from companies like NVIDIA, AMD, and Intel.
Huawei's entry into DRAM manufacturing with significant capacity will increase China's domestic memory supply, reducing reliance on foreign technology amid US sanctions.