SK Hynix is reportedly stepping up development of 3D DRAM for on-device AI, actively recruiting 3D-Stacked DRAM-on-Logic Design Engineers in San Jose, California, and partnering with a specific customer for application development. The company is also collaborating with TSMC to apply its advanced logic process to HBM4 base dies, with plans to expand this technology to High Bandwidth Flash (HBF) and 3D-Stacked DRAM-on-Logic.
Memory architecture is shifting beyond HBM to 3D DRAM and integrated logic, indicating a new frontier for AI compute efficiency and power.