The companies signed a memorandum of understanding (MOU) to broaden their collaboration on next-generation AI infrastructure, spanning leading-edge memory, foundry technologies, and advanced packaging. This collaboration is estimated at more than $200 billion over the next five years through 2030, covering HBM supply for Broadcom's AI accelerators and Samsung's 2-nanometer and below process technologies for Broadcom's products.
A $200B+ commitment locks in significant advanced packaging, HBM, and leading-edge foundry capacity for Broadcom, tightening supply for other AI chip developers.