Samsung Electronics and Broadcom announced a comprehensive five-year cooperation agreement to strengthen their partnership in AI semiconductor design and manufacturing, with the collaboration expected to reach approximately 290 trillion won. The partnership will focus on high-bandwidth memory (HBM) and advanced packaging technologies, leveraging Samsung's manufacturing and Broadcom's AI chip design expertise.
A massive, long-term partnership secures Samsung's HBM and advanced packaging capacity for Broadcom's AI chip designs, tightening supply for other customers.