Goldman Sachs Expand Capacity, Aim for 3D DRAM by 2027
Chinese DRAM suppliers are reportedly achieving comparable pricing to global leaders despite lower yields, with expectations for further progress in 3D DRAM product development by 2027. Significant capacity expansions in Hefei, Shanghai, and Beijing are projected to be fully operational by 2028, utilizing mostly domestically produced equipment, excluding high-end lithography systems.