TSMC's Photonic Integrated Circuit (PIC) capacity is projected to increase from 500 wafers per month to 10,000 wafers by Q2 2026, further rising to 15,000 wafers by Q4 2026. By 2028, capacity is expected to reach at least 25,000 wafers per month, primarily serving NVIDIA, Broadcom, and AMD for COUPE platform volume production in 2026–2027.
TSMC's aggressive ramp of co-packaged optics capacity locks in critical networking supply for major AI chip designers, accelerating CPO adoption.