Goldman Sachs updated its market report, shifting NAND and DRAM supply from "tight" to "very tight" through Q2 2027, with T-Glass also moving from "balanced" to "tight" in CY27. Like-for-like DRAM prices are projected to surge 250-300% in 2026, while advanced substrates like ABF and CCL face 30-50% price increases in 2026, climbing to 45-60% in 2027. TSMC foundry capacity, optical components, and global power & analog semiconductors are expected to remain severely constrained through 2027.
The entire AI infrastructure supply chain, from memory to advanced packaging and optical interconnects, faces extreme, multi-year tightness, driving unprecedented price increases for critical components.