The PCB industry faces severe supply gaps for high-end glass fabric, with Low-DK (Gen 2) seeing a 60%+ deficit and T-glass projected to hit 50%+ through 2028. Tier-1 Copper Clad Laminate (CCL) manufacturers implemented 20-30% price increases in H1 2026, with sequential hikes expected through 2027. IC substrate capacity is fully sold out through 2027, with a projected 40%+ supply deficit for 2027, forcing clients to pay massive premiums for advanced material allocations.