TSMC is expanding its advanced packaging capacity, with market chatter suggesting monthly CoWoS output will reach at least 200,000 wafers in 2027. Equipment makers face delays in finalizing TSMC's order allocation, leading to concerns about price competition and delivery delays, as lead times for equipment currently span seven to nine months.
TSMC's aggressive CoWoS expansion aims to alleviate advanced packaging bottlenecks, but current equipment lead times and order delays indicate persistent supply tightness through 2027.