The new technology aims to address rising power consumption and data-transfer bottlenecks in AI data centers. This integration combines high-bandwidth memory (HBM), logic chips, and silicon photonics (SiPh) into a single package.
“We have won a $16.5 billion order from Tesla for a next-generation product to be built based on our advanced process technology, which demonstrates the competitiveness of our advanced process capabilities.”
Samsung Electronics·Q2 2025 earnings
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