Intel Ships First High-Volume Logic Chips Using ASML's High NA EUV

Intel has become the first company to ship high-volume logic chips, specifically select Panther Lake layers on its 18A process, utilizing ASML's advanced High NA EUV scanners. These 18A layers are now dual-qualified for 0.55 NA scanners, marking a significant step in leading-edge semiconductor manufacturing.

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Sources (2)

Intel Ships High-Volume Logic Products Using ASML High NA EUV Lithography

PRIMARYTom's Hardware · RSS · 7d ago

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Intel Ships First High-Volume Logic Chips Using ASML's High NA EUV

Tom's Hardware · RSS · 7d ago

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Related Signals

7d agoSignalIntel Foundry Enters High-Volume Manufacturing for Panther Lake Using ASML High NA EUV→6d agoMfgIntel Foundry Begins Mass Production with ASML High-NA EUV Lithography for 18A Node→7d agoMfgASML Announces Intel Foundry Enters High-Volume Manufacturing for Core Ultra Series 3 Using High NA EUV on 18A→7d agoMfgIntel Foundry Ships First High-Volume Logic Product Using High-NA EUV Lithography→5d agoPricingASML Considers EUV Price Hikes, Angering TSMC Over Future Chip Costs→

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Lead sourceTom's Hardware

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Updated 7d ago · 2 sources

Intel Ships First High-Volume Logic Chips Using ASML's High NA EUV

Intel has become the first company to ship high-volume logic chips, specifically select Panther Lake layers on its 18A process, utilizing ASML's advanced High NA EUV scanners. These 18A layers are now dual-qualified for 0.55 NA scanners, marking a significant step in leading-edge semiconductor manufacturing.

Read Source→