Birentech Showcases NPO Optical Interconnect for Trillion-Parameter AI Models
Birentech unveiled its new solution for trillion-parameter large model computing power, featuring NPO optical interconnect technology, at the World Artificial Intelligence Conference (WAIC) held in Shanghai from July 17-20, 2026.
So What
Optical interconnect technology is emerging as a critical component for scaling large AI models, driving demand for specialized networking solutions.