Birentech Unveils NPO Optical Interconnect Solution for 1,024 AI Accelerator Cards
The Chinese chip startup's next-generation supernode solution uses Near-Package Optics (NPO) and a distributed decoupled architecture to support single clusters of up to 1,024 AI accelerator cards. Birentech's BR2xx series GPU, built on a Chiplet architecture, supports FP8/FP4 low-precision computing and integrates supernode interconnect capabilities for large-scale AI cluster deployment.