Samsung Electronics has started constructing a die-to-wafer (D2W) hybrid bonding mass-production line at its Pyeongtaek Campus for next-generation HBM and logic semiconductors. The company has selected Besi as a preferred supplier and is acquiring 50 D2W hybrid bonding machines, with SEMES and Hanwha Semitech also being considered for supply. Samsung internally expects large-scale production using hybrid bonding to become feasible around 2030, aligning with Nvidia's next-generation AI accelerator, Feynman.
Samsung's hybrid bonding investment signals a long-term shift in advanced packaging for HBM and logic, but mass production is years away, delaying its impact.