Facilities engineering contractor Hantang reported signed but unrecognized orders reached 193.9 billion yuan by the end of May this year, driven by strong global semiconductor fab construction. This backlog provides order visibility extending through 2028, fueled by TSMC's Arizona expansion and other overseas wafer and memory fab projects.
Massive fab construction backlogs for Hantang indicate sustained, aggressive capital expenditure by chipmakers for compute and memory capacity through 2028.