The white paper outlines how Co-packaged Optics (CPO) reduces electrical loss, improves energy efficiency, and enables higher bandwidth densities for 800G and 1.6T interconnects. It addresses challenges like thermal management and signal integrity by integrating optical interconnect closer to silicon. Synopsys supports CPO adoption through its silicon-proven interface IP and EDA solutions.
Co-packaged optics are becoming essential for scaling AI data center bandwidth and power efficiency, pushing current electrical and pluggable optical limits.