Scaling co-packaged optics (CPO) for AI infrastructure demands a shift from traditional photonic device design kits (PDKs) to comprehensive realization interface kits that integrate optical, electrical, thermal, and mechanical aspects. The industry must address the complex 'copper-light boundary' where electrical signals transition to optical, managing coupling loss, thermal drift, and manufacturing variability. Packaging PDKs are becoming strategic, bridging device design with system-level realization to ensure CPO can be built, tested, and trusted at scale.
Co-packaged optics scaling is bottlenecked by packaging integration, not just device performance, increasing complexity and cost for AI infrastructure buildouts.