SK Hynix has initiated full-scale preparations for its Yongin Y1 fab, placing orders for advanced DRAM manufacturing equipment to establish a pilot production line by February next year. The initial investment targets approximately 20,000 wafers per month of 1c DRAM, which will be used in high-value DDR/LPDDR products for AI and seventh-generation HBM4E. The company has also advanced the overall Yongin semiconductor cluster completion timeline by 12 years to 2033, involving a total investment of KRW 600 trillion.
SK Hynix is aggressively expanding advanced DRAM and HBM capacity ahead of schedule, signaling a strong commitment to AI memory supply.