UMC is evaluating new plans for its Fab 12A P7 near Tainan, Taiwan, driven by surging demand for advanced packaging components like silicon interposers and deep trench capacitors (DTC), as well as power management chips (PMICs) for AI products. The foundry is collaborating with Qualcomm on silicon interposers and hybrid bonding, with Intel on 12nm FinFET, and with SanDisk for memory chip stacking.