Intel has relaunched its global manufacturing sites, pushing ahead with Intel 18A mass production and 14A and high-NA EUV development. The company is also advancing its EMIB, EMIB-T, Foveros, and hybrid bonding advanced packaging programs to build an end-to-end manufacturing platform.
Intel's accelerated foundry roadmap and advanced packaging efforts intensify competition for leading-edge chip manufacturing capacity, offering an alternative to TSMC.