Fabscond, a facilities engineering firm, achieved record revenues for June and Q2, with H1 also setting a new record for the period, indicating robust demand for semiconductor capacity expansion. Industry analysts project Fabscond's EPS to reach 25.6 yuan this year, fueled by AI and TSMC's wafer and advanced packaging capacity buildout.
Facilities engineering firms are seeing direct revenue growth from AI-driven semiconductor capacity expansion, indicating sustained capex in chip manufacturing infrastructure.