TSMC's A16 technology, featuring Super Power Rail (SPR) for backside direct-contact power delivery, offers 8-10% higher speed at the same power or 15-20% lower power at the same speed compared to N2P. This platform also provides an 8-10% chip-density gain, with mass production targeted for Q4 2026.
TSMC's A16 process with backside power delivery structurally changes chip power distribution, improving electrical efficiency and physical design for next-gen AI/HPC accelerators.