The article highlights the intricate process of optimizing thousands of connections between chiplets, interposers, and package BGAs in multi-chiplet packages, which is crucial for ensuring electrical performance and interface protocol compliance. It emphasizes the need for early, predictive multiphysics analysis during RTL and chiplet floorplanning to mitigate thermal and mechanical risks, reducing costly redesigns and accelerating time-to-production.
The complexity of 3D-IC design and verification is a binding constraint on advanced AI chip development, requiring earlier, more integrated analysis to avoid costly delays.