Optimizing on-chip and inter-chiplet communication is crucial for realizing speed gains from leading-edge AI accelerators and multi-die architectures, but current verification and simulation tools struggle with the scale and complexity of coherent and non-coherent traffic. The NoC boundary has moved to the package edge with chiplets, introducing new challenges for timing, retry semantics, and error handling that can lead to costly deadlocks at bring-up.
Inter-chiplet communication and verification are becoming binding variables for advanced AI chip performance, shifting design complexity to the package edge.