Hanmi Semiconductor has won orders from Micron for 50 TC bonders and is expanding its supply to SK Hynix for HBM4 capacity buildout. The company is also in exclusive talks with Samsung Electronics for HBM process equipment supply, indicating a thawing of ties and potential HBM4 collaboration.
Hanmi Semiconductor is now a critical supplier for HBM4 production across all three major memory manufacturers, tightening the supply chain for advanced packaging equipment.