TSMC's Chairman and CEO, Dr. C.C. Wei, stated that the company's advanced packaging capacity is so tight it is limiting customer expansion, expressing openness to Intel's EMIB-T technology to help absorb some of this load. The company reported Q2 2026 revenue of US$40.2 billion, reaching the high end of guidance, up 12% QoQ and 34% YoY, with gross margin at 67.7% and operating margin at 60.3%.
Advanced packaging capacity remains a binding constraint for AI compute growth, forcing TSMC to welcome competition to unblock its front-end wafer business.