PhotonCap field research indicates TSMC leads in switch Co-Packaged Optics (CPO) with Broadcom's 102.4T switch and NVIDIA's photonics switches in production. Samsung is developing a 2.xD package that binds HBM, logic, and silicon photonics on a single interposer, leveraging its capability to manufacture all three components. The success of this strategy hinges on a named design win within twelve months, despite multi-die yield penalties and external HBM integration challenges.