TYLsemi Raises $43 Million for Custom AI Chiplet Platform
The oversubscribed early-stage round was led by Matter Venture Partners, with participation from Viola Ventures, Global Hands-On VC (GHOVC), and Egis Technology. TYLsemi emerged from stealth with a full-stack chiplet platform for custom AI silicon, aiming to cut development time and cost by up to 50%.