Taiwan Semiconductor Manufacturing Company (TSMC) intends to construct 25 new fabrication plants within the next five years, driven by semiconductor supply shortages and demand from AI data centers. This expansion aims to increase TSMC's current production capacity by 1.5 times from its existing 16 fabs, comprising 11 front-end and 5 back-end facilities.
TSMC's aggressive fab buildout signals a structural commitment to meet sustained AI compute demand, ensuring future leading-edge wafer supply for hyperscalers.