Domestic research institutions estimate Powerchip Semiconductor's EPS will surge to NT$5.68 this year, driven by its high-density silicon capacitor technology for Intel's EMIB advanced packaging chain. The company's memory, 3DAI advanced packaging, and logic optimization product lines are successively ramping up production.
Advanced packaging capabilities are driving profitability for memory and foundry players, shifting value capture to integration expertise beyond raw wafer output.