TSMC plans to increase wafer foundry prices for both advanced and mature process technologies by a maximum of 10% starting in 2027, with negotiations already completed with customers in July. The price hike reflects rising raw material costs, semiconductor equipment expenses, and new overseas fab construction. Customers placing additional high-performance computing (HPC) chip orders exceeding original forecasts will face an additional 10-15% premium.
The cost of AI chips will rise significantly from 2027, with hyperscalers facing even higher premiums for additional HPC orders.