The commentary suggests Intel's EMIB-T advanced packaging technology is positioned to help fill the existing capacity gap in TSMC's CoWoS production, which is critical for high-performance AI accelerators.
“Second, we have reduced our capital expenditures by over 20% relative to the plan we had entering the year. We are now well positioned with our shell ahead strategy to react quickly to market demand.”
IntelCEO·Q3 2024 earnings
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