Google is reportedly considering Intel's EMIB-T packaging for its Ninth-Generation TPU, codenamed Humufish, moving away from its long-standing use of TSMC's CoWoS technology. This potential shift, if accurate, represents a significant and complex decision for Google, impacting advanced packaging strategies for leading chip designers and hyperscalers.
Intel's advanced packaging gains a major hyperscaler customer, directly challenging TSMC's CoWoS dominance for custom AI silicon.