ASML is accelerating its capacity expansion plans, targeting a 30% increase in its 2026 low NA EUV capacity (around 65 units) for 2027, with further investigation for 2028. The company also plans to add 30% to its 2026 DUV immersion capacity (around 130 units) for 2027, with similar plans for 2028. This expansion is driven by ongoing AI-related investments and customer commitments for advanced Logic and Memory chips.
ASML's aggressive capacity expansion for advanced lithography tools confirms sustained, long-term demand for leading-edge AI compute and memory manufacturing.