NVIDIA and TSMC Prepare for Co-Packaged Optics Mass Production by 2028

NVIDIA and TSMC are actively preparing for the mass production of Co-Packaged Optics (CPO) technology, with significant scaling expected to commence in 2028. This development is anticipated to benefit Taiwanese manufacturers such as Sanan and Transcore, who are positioned to support the CPO supply chain.

So What

The shift to CPO by NVIDIA and TSMC will integrate optical interconnects directly into AI chips, tightening the networking supply chain for specialized components.

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NVIDIA and TSMC Prepare for Co-Packaged Optics Mass Production by 2028

工商時報 · RSS · 8h ago

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Updated 8h ago · 1 source

NVIDIA and TSMC Prepare for Co-Packaged Optics Mass Production by 2028

NVIDIA and TSMC are actively preparing for the mass production of Co-Packaged Optics (CPO) technology, with significant scaling expected to commence in 2028. This development is anticipated to benefit Taiwanese manufacturers such as Sanan and Transcore, who are positioned to support the CPO supply chain.

So What

The shift to CPO by NVIDIA and TSMC will integrate optical interconnects directly into AI chips, tightening the networking supply chain for specialized components.

Read Source→