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CoWoS packaging stays tight
CoWoS is the advanced packaging that fuses a GPU to its memory, and it has been a binding chokepoint of the AI build. Tessara scores how scarce it is, from 0 to 100, updated daily.
Tessara Research · Free
We watch what breaks first.
Independent research on the physical bottlenecks behind the AI buildout: compute, memory, power, and networking, mapped to the public companies exposed to each.
Free. No spam. 1 to 2 memos a week.
Source-backed constraint intelligence for the AI build.