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◆ TESSARA
◆ TESSARA JULY 23, 2026 AI BUILDOUT STATUS 65% SUPPLY STRESS TIGHT OR TIGHTER 35 / 54 BINDING NOW DRAM DDR5 DRAM DDR5 BINDING · CRITICAL 86 Blackwell GPU CRITICAL 87 OSAT Packaging CRITICAL 84 Power Transformers CRITICAL 83 FC-BGA Substrate CRITICAL 82 NAND Flash CRITICAL 80 HBM3e CRITICAL 80 Indium Phosphide TIGHT 79 Chinese AI Accel. TIGHT 79 tessara.tech NEW READ EVERY MONDAY

AI Buildout Status

The live supply board for the AI buildout: which inputs are tight or tighter right now, the single constraint binding hardest this week, and the share of the tracked supply lane under stress. It reads straight from the world model and updates as the scores move.
Open the Constraint Radar →
Tessara Research · Free
We watch what breaks first.
Independent research on the physical bottlenecks behind the AI buildout: compute, memory, power, and networking, mapped to the public companies exposed to each.
Free. No spam. 1 to 2 memos a week.
Source-backed constraint intelligence for the AI build.

Tessara is independent research and analysis, not investment advice. We are not a registered investment adviser. Past performance is not indicative of future results, and you are responsible for your own investment decisions.

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